Coreless three-layer separator
Manufacturing method for thin CORELESS PCBs! Automatically loads DUMMY cores and PANELS.
The "Coreless Three-Layer Separator" is an automatic separation device for thin plates that corrects warpage and automatically loads/unloads. It is a manufacturing method for thin coreless PCBs that separates coreless products (3 to 5 layers) stacked on a dummy carrier substrate at the top and bottom. The panel sizes are 615 (L) × 510 (W) and 510 (L) × 415 (W) ±0.5mm. 【Main Equipment Structure】 ■ Loader/Unloader (Horizontal stacking or BOX or BOX + interleaving paper) ■ Panel Separation (#1, #2) ■ Panel Warpage Correction (#1, #2) - OPTION ■ Dedicated Trolley 2 units *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ラットコーポレーション 本社：営業部・業務部
- Price：Other
